English translation for "flip chip bonding"
|
- 倒装焊接
倒装片接合
Related Translations:
- Example Sentences:
| 1. | Flip chip bonding technology used in modern micro - photoelectron package 现代微光电子封装中的倒装焊技术 | | 2. | In this thesis , the work on automatic alignment system is as follows : firstly , after the methods and optical systems for alignment whose are used commonly now are discussed , a new die leveling method based on auto - focus is presented for the flip chip bonder . auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations 本文针对倒装贴片机的自动对准系统开展了以下几方面的工作:首先在讨论了现有的对准方法和自动贴片机的对准光路系统基础上,针对贴片机实际应用环境,提出基于多点自动对焦的芯片调平方法。 | | 3. | An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry . it develops for the mass production of ic , mems and moems with small feature sizes and high precise bonding demands . an alignment system is one of the key components in flip chip bonders 全自动倒装贴片机( flipchipbonder )是半导体生产工艺中完成芯片和基底对准、键合的高精度自动化设备,适合于特征尺寸小,键合精度要求高的ic ( integratedcircuit ) 、 mems ( microelectromechanicalsystem ) 、 moems ( microopticalelectromechanicalsystems )等的大规模生产。 |
- Similar Words:
- "flip canvas horizontal" English translation, "flip canvas vertical" English translation, "flip chart" English translation, "flip chip" English translation, "flip chip approach" English translation, "flip chip bump" English translation, "flip chip carrier" English translation, "flip chip integrated circuit" English translation, "flip chip led" English translation, "flip chip method" English translation
|
|
|